Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8702017 | Nozzle device employing high frequency wave energy | Lap Kei Chow, Hoi Shuen TANG, Hon Keung Lai | 2014-04-22 |
| 8657181 | Wedge bonder and a method of cleaning a wedge bonder | Man Kit Mui | 2014-02-25 |
| 8538576 | Method of configuring a dicing device, and a dicing apparatus for dicing a workpiece | Lap Kei Chow, Man Kin Leung, Hoi Shuen TANG | 2013-09-17 |
| 8434669 | Universal bond head for wire bonders | Man Kit Mui | 2013-05-07 |
| 8354612 | Laser processing apparatus | Lap Kei Chow, Zhuanyun Zhang, Sze Leong Lai | 2013-01-15 |
| 8289388 | Alignment method for singulation system | Lap Kei Chow | 2012-10-16 |
| 8251422 | Apparatus for transferring electronic components in stages | Wang Lung Tse, Leung Por Chan | 2012-08-28 |
| 8167523 | Singulation handler comprising vision system | Lap Kei Chow | 2012-05-01 |
| 8167524 | Handling system for inspecting and sorting electronic components | Wang Lung Tse, Tim Wai Tony Mak, Lap Kei Chow | 2012-05-01 |
| 8091762 | Wedge bonding method incorporating remote pattern recognition system | Man Kit Mui, Hon Kam Ng, Hei Lam Chang | 2012-01-10 |
| 8037996 | Transfer apparatus for handling electronic components | Wang Lung Tse, Chi Hang Leung | 2011-10-18 |
| 8011058 | Singulation handler system for electronic packages | Wang Lung Tse, Tim Wai Tony Mak, Ming Cheong Kary Tse | 2011-09-06 |
| 7849847 | Drainage apparatus for a singulation system | Lap Kei Chow, Chi Hang Leung | 2010-12-14 |
| 7762449 | Bond head for heavy wire bonder | Tim Wai Tony Mak, Hon Kam Ng | 2010-07-27 |
| 7726540 | Apparatus and method for arranging devices for processing | Hoi Shuen TANG, Tim Wai Tony Mak, See Lok Chan | 2010-06-01 |
| 7495759 | Damage and wear detection for rotary cutting blades | Lap Kei Chow | 2009-02-24 |
| 7258703 | Apparatus and method for aligning devices on carriers | Hoi Shuen TANG, Tim Wai Tony Mak, Chi Hang Leung | 2007-08-21 |
| 7190446 | System for processing electronic devices | Hoi Fung Tsang, Chi Yat Yeung, Wang Lung Tse | 2007-03-13 |
| 7147721 | Apparatus and method for cleaning electronic packages | Yui Ko Wong, Tim Wai Tony Mak | 2006-12-12 |
| 6983872 | Substrate alignment method and apparatus | Ping Chun Benson Chong, Chin Pang Chan | 2006-01-10 |
| 6766938 | Apparatus and method of placing solder balls onto a substrate | Ping Chun Benson Chong, Chi Fung Michael Chan, Chin Pang Chan | 2004-07-27 |
| 6607118 | Apparatus and method for ball release | Ping Kong Choy, Ping Chun Benson Chong, Ka Kin Wong, Chi Fung Michael Chan | 2003-08-19 |
| 6386422 | Solder reflow oven | Ping Chun Benson Chong, Hoi Shuen TANG, Kai Wu, Ka On Yue | 2002-05-14 |
| 6276598 | Method and apparatus for ball placement | Alfred Ka On Yue, Chiu Fai Wong | 2001-08-21 |
| 6109501 | Radial wire bonder and selectable side view inspection system | Ka On Yue, Chiu Fai Wong | 2000-08-29 |