Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6983872 | Substrate alignment method and apparatus | Chi Wah Cheng, Chin Pang Chan | 2006-01-10 |
| 6766938 | Apparatus and method of placing solder balls onto a substrate | Chi Wah Cheng, Chi Fung Michael Chan, Chin Pang Chan | 2004-07-27 |
| 6607118 | Apparatus and method for ball release | Chi Wah Cheng, Ping Kong Choy, Ka Kin Wong, Chi Fung Michael Chan | 2003-08-19 |
| 6386422 | Solder reflow oven | Chi Wah Cheng, Hoi Shuen TANG, Kai Wu, Ka On Yue | 2002-05-14 |