MM

Man Kit Mui

AP Asm Technology Singapore Pte: 2 patents #76 of 338Top 25%
AA Asm Assembly Automation: 1 patents #73 of 182Top 45%
AP Asmpt Singapore Pte.: 1 patents #14 of 77Top 20%
Overall (All Time): #1,136,334 of 4,157,543Top 30%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
11842978 Wire bonding system including a wire biasing tool Kwun Ng 2023-12-12
8657181 Wedge bonder and a method of cleaning a wedge bonder Chi Wah Cheng 2014-02-25
8434669 Universal bond head for wire bonders Chi Wah Cheng 2013-05-07
8091762 Wedge bonding method incorporating remote pattern recognition system Chi Wah Cheng, Hon Kam Ng, Hei Lam Chang 2012-01-10