Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10324126 | Method and apparatus for aligning probe pins with respect to positions of electronic devices | Yu Sze Cheung, Chun Shing Yip | 2019-06-18 |
| 9461013 | Wire spool system for a wire bonding apparatus | Chi Wah Cheng | 2016-10-04 |
| 8091762 | Wedge bonding method incorporating remote pattern recognition system | Chi Wah Cheng, Man Kit Mui, Hei Lam Chang | 2012-01-10 |
| 7762449 | Bond head for heavy wire bonder | Chi Wah Cheng, Tim Wai Tony Mak | 2010-07-27 |