Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592259 | Method of fabricating a wafer level semiconductor package having a pre-formed dielectric layer | Kevin Hu, Edward Law | 2013-11-26 |
| 8417200 | Wideband power efficient high transmission power radio frequency (RF) transmitter | Ray (Ramon) Gomez, Leonard Dauphinee, Massimo Brandolini, Jianhong Xiao, Dongsoo Daniel Koh +2 more | 2013-04-09 |
| 8138608 | Integrated circuit package substrate having configurable bond pads | — | 2012-03-20 |
| 8102027 | IC package sacrificial structures for crack propagation confinement | Sam Ziqun Zhao, Rezaur Rahman Khan | 2012-01-24 |
| 7781882 | Low voltage drop and high thermal performance ball grid array package | Reza-ur Rahman Khan | 2010-08-24 |
| 7683495 | Integrated circuit package substrate having configurable bond pads | — | 2010-03-23 |