MC

Ming-Tsung Chen

AC Apaq Technology Co.: 26 patents #1 of 32Top 4%
UM United Microelectronics: 24 patents #216 of 4,560Top 5%
DE Delta Electronics: 6 patents #304 of 2,746Top 15%
CC Cheng Uei Precision Industry Co.: 5 patents #117 of 502Top 25%
NC Nanning Fugui Precision Industrial Co.: 3 patents #8 of 173Top 5%
SC Shanghai Sansi Electronic Engineering Co.: 3 patents #7 of 46Top 20%
SC Shanghai Sansi Technology Co.: 3 patents #8 of 47Top 20%
TSMC: 2 patents #6,667 of 12,232Top 55%
IC Inpaq Technology Co.: 2 patents #17 of 93Top 20%
JC Jiashan Sansi Photoelectric Technology Co.: 2 patents #1 of 20Top 5%
Foxconn: 1 patents #3,106 of 5,504Top 60%
GL Great Wall Motor Company Limited: 1 patents #145 of 351Top 45%
UN Unknown: 1 patents #29,356 of 83,584Top 40%
XU Xiamen University: 1 patents #109 of 433Top 30%
Overall (All Time): #21,594 of 4,157,543Top 1%
82
Patents All Time

Issued Patents All Time

Showing 26–50 of 82 patents

Patent #TitleCo-InventorsDate
10361036 Capacitor package structure SHANG-CHE LAN, Yi-Liang Chen 2019-07-23
10342106 Smart dimming system SZU-MEI SUN 2019-07-02
10249446 Stacked-type solid electrolytic capacitor package structure and method of manufacturing the same Chien-Wei Lin, SHANG-CHE LAN 2019-04-02
10192687 Capacitor assembly having a non-symmetrical electrode structure and capacitor seat structure thereof Hsi-Dung Lin, Ching-Feng Lin 2019-01-29
10163576 Capacitor cathode foil structure and manufacturing method thereof Ching-Feng Lin 2018-12-25
10136386 Wireless network device Hsing-Hsu Chen, Shih-Chang Hsu 2018-11-20
10079114 Stacked-type solid electrolytic capacitor capable of increasing welding effect and manufacturing method of the same Chien-Wei Lin 2018-09-18
10068711 Solid electrolytic capacitor package structure for increasing electrical performances and method of manufacturing the same, and capacitor unit thereof Chieh Lin 2018-09-04
9884758 Selective nitride outgassing process for MEMS cavity pressure control Shyh-Wei Cheng, Hsi-Cheng Hsu, Hsin-Yu Chen, Ji-Hong Chiang, Jui-Chun Weng +3 more 2018-02-06
9826477 Wireless network device Hsing-Hsu Chen, Shih-Chang Hsu 2017-11-21
9824827 Method for making solid electrolytic capacitor package structure with improved conductive terminals Chi-Hao Chiu, Kun-Huang Chang 2017-11-21
9754729 Solid-state electrolytic capacitor with improved metallic anode and method for manufacturing the same Chi-Hao Chiu, CHAI-CHING SUNG 2017-09-05
9653216 Sealing element and wound-type solid state electrolytic capacitor thereof Ching-Feng Lin 2017-05-16
9627149 Solid electrolytic chip capacitor and manufacturing method thereof YI-YING WANG 2017-04-18
9490075 Method for fabricating solid electrolytic capacitors Ching-Feng Lin 2016-11-08
9443970 Semiconductor device with epitaxial structures and method for fabricating the same Hsin-Ming Hou, Yu-Cheng Tung, Ji-Fu Kung, Wai-Yi Lien 2016-09-13
9437367 Method of manufacturing a winding-type solid electrolytic capacitor package structure without using a lead frame Ching-Feng Lin 2016-09-06
9378895 Method of manufacturing a winding-type solid electrolytic capacitor package structure using a lead frame Ching-Feng Lin 2016-06-28
9318571 Gate structure and method for trimming spacers I-Chang Wang, Ling-Chun Chou, Po-Chao Tsao, Tsung-Hung Chang, Hui-Ling Chen +3 more 2016-04-19
9312359 Semiconductor structure and fabrication method thereof Ming-Te Wei, Shin-Chuan Huang, Yu-Hsiang Hung, Po-Chao Tsao, Chia-Jui Liang +1 more 2016-04-12
9312072 Winding-type solid electrolytic capacitor package structure using a carrier board and method of manufacturing the same Ching-Feng Lin 2016-04-12
9202914 Semiconductor device and method for fabricating the same Hsin-Ming Hou, Yu-Cheng Tung, Ji-Fu Kung, Wai-Yi Lien 2015-12-01
9159490 Solid electrolytic capacitor package structure and method of manufacturing the same, and conductive unit Chi-Hao Chiu, Kun-Huang Chang 2015-10-13
9153383 Winding-type solid electrolytic capacitor package structure without using a lead frame Ching-Feng Lin 2015-10-06
9147528 Winding-type solid electrolytic capacitor package structure using a lead frame Ching-Feng Lin 2015-09-29