Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6554949 | Wafer demount receptable for separation of thinned wafer from mounting carrier | Daniel Stofman | 2003-04-29 | $1,689,000 |
| 6491083 | Wafer demount receptacle for separation of thinned wafer from mounting carrier | Daniel Stofman | 2002-12-10 | $2,205,000 |
| 6470946 | Wafer demount gas distribution tool | — | 2002-10-29 | $1,717,000 |
| 6415843 | Spatula for separation of thinned wafer from mounting carrier | Mark Spencer Grey | 2002-07-09 | $3,070,000 |
| 5474667 | Reduced stress sputtering target and method of manufacturing therefor | Steven Hurwitt, Tugrul Yasar, Jon Hsu | 1995-12-12 | |
| 5408322 | Self aligning in-situ ellipsometer and method of using for process monitoring | Jon Hsu, Rodney L. Robison, Tugrul Yasar | 1995-04-18 |