Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6554949 | Wafer demount receptable for separation of thinned wafer from mounting carrier | Bhola De | 2003-04-29 | $1,689,000 |
| 6491083 | Wafer demount receptacle for separation of thinned wafer from mounting carrier | Bhola De | 2002-12-10 | $2,205,000 |