Issued Patents All Time
Showing 26–50 of 65 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10199322 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2019-02-05 |
| 10163855 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2018-12-25 |
| 10090185 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2018-10-02 |
| 10079157 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Seong Min Seo, Sung Geun Kang, Yong Seon Song, Wang Gu Lee +3 more | 2018-09-18 |
| 10032740 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2018-07-24 |
| 9966276 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2018-05-08 |
| 9818685 | Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers | Jong Sik Paek, Jin Young Kim, YoonJoo Kim, Jin Han Kim, Seungjae Lee +4 more | 2017-11-14 |
| 9818721 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2017-11-14 |
| 9793180 | Semiconductor device and manufacturing method thereof | Seo Yeon Ahn, Pil Je Sung, Won Chul Do, Young Rae Kim, Seung Chul Han +2 more | 2017-10-17 |
| 9728514 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2017-08-08 |
| 9711484 | Semiconductor package with semiconductor die directly attached to lead frame and method | Jong Sik Paek, Wang Gu Lee, Yong Seon Song, Sung Geun Kang | 2017-07-18 |
| 9627368 | Semiconductor device using EMC wafer support system and fabricating method thereof | Jin Young Kim, Ju Hoon Yoon, Seong Min Seo, Glenn Rinne, Choon Heung Lee | 2017-04-18 |
| 9627353 | Method of manufacturing a semiconductor package | Michael Kelly, David Jon Hiner, Ji Hun Lee, Won Chul Do, Ronald Patrick Huemoeller | 2017-04-18 |
| 9536858 | Semiconductor device and manufacturing method thereof | Won Chul Do, Jong Sik Paek, Ji Hun Lee, Seong Min Seo | 2017-01-03 |
| 9502375 | Semiconductor device with plated pillars and leads | Jong Sik Paek, Seong Min Seo | 2016-11-22 |
| 9484331 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2016-11-01 |
| 9478517 | Electronic device package structure and method of fabricating the same | Jong Sik Paek, Yoon Joo Kim, Seong Min Seo, Young Suk Chung | 2016-10-25 |
| 9437575 | Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives | Michael Kelly, David Jon Hiner, Ji Hun Lee, Won Chul Do, Ronald Patrick Huemoeller | 2016-09-06 |
| 9418922 | Semiconductor device with reduced thickness | Jong Sik Paek | 2016-08-16 |
| 9406638 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2016-08-02 |
| 9391043 | Semiconductor device and manufacturing method thereof | Jong Sik Paek, Won Chul Do, Eun Ho Park, Sung Jae Oh | 2016-07-12 |
| 9219042 | Semiconductor device and manufacturing method thereof | Jong Sik Paek | 2015-12-22 |
| 9214434 | Fan-out semiconductor package | Jin Young Kim, Seung Jae Lee | 2015-12-15 |
| 9196601 | Semiconductor device | Seong Min Seo, Seok Woo Yun, Ji Hun Lee, Seo Yeon Ahn, Young Rae Kim +1 more | 2015-11-24 |
| 9190370 | Semiconductor device utilizing redistribution layers to couple stacked die | Jong Sik Paek, Won Chul Do, Pil Je Sung, Jin-Hee Park, Do Hyung Kim +4 more | 2015-11-17 |