Issued Patents All Time
Showing 26–38 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7220915 | Memory card and its manufacturing method | Chul-Woo Park, Sang Jae Jang, Sung Su Park, Suk Gu Ko | 2007-05-22 |
| 7201327 | Memory card and its manufacturing method | Chul-Woo Park, Sang Jae Jang, Sung Su Park, Suk Gu Ko | 2007-04-10 |
| 7042072 | Semiconductor package and method of manufacturing the same which reduces warpage | Young-Ho Kim, Seok Hyun Choi, Sung Su Park, Sung Soon Park | 2006-05-09 |
| 6995448 | Semiconductor package including passive elements and method of manufacture | Sang Ho Lee, Jun Yang, Seon Goo Lee, Jong Hae Hyun | 2006-02-07 |
| 6995459 | Semiconductor package with increased number of input and output pins | Donald C. Foster, Jeoung Kyu Choi, Wan-Jong Kim, Kyong Hoon Youn, Sang Ho Lee +1 more | 2006-02-07 |
| 6982485 | Stacking structure for semiconductor chips and a semiconductor package using it | Seon Goo Lee, Young-Ho Kim | 2006-01-03 |
| 6936922 | Semiconductor package structure reducing warpage and manufacturing method thereof | Sung Soon Park, Sang Jae Jang, Seon Goo Lee, Eun Sook Sohn, Sung Su Park | 2005-08-30 |
| 6927483 | Semiconductor package exhibiting efficient lead placement | Sun Goo Lee, Sang Ho Lee | 2005-08-09 |
| 6879034 | Semiconductor package including low temperature co-fired ceramic substrate | Jun Yang, Sun Goo Lee | 2005-04-12 |
| 6876068 | Semiconductor package with increased number of input and output pins | Donald C. Foster, Jeoung Kyu Choi, Wan-Jong Kim, Kyong Hoon Youn, Sang Ho Lee +1 more | 2005-04-05 |
| 6867071 | Leadframe including corner leads and semiconductor package using same | Sung Sik Jang, Su Yol Yoo | 2005-03-15 |
| 6750545 | Semiconductor package capable of die stacking | Sun Goo Lee, Sang Jae Jang, Akito Yoshida | 2004-06-15 |
| 6469258 | Circuit board for semiconductor package | Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee, Won Kyun Lee +2 more | 2002-10-22 |