Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6320400 | Method and system for selectively disconnecting a redundant power distribution network to indentify a site of a short | J. Courtney Black, Mehrdad Mahanpour, Mohammad Massoodi, S. Sidharth | 2001-11-20 |
| 6315936 | Encapsulation method using non-homogeneous molding compound pellets | J. Courtney Black, Colin Hatchard | 2001-11-13 |
| 6294923 | Method and system for detecting faults utilizing an AC power supply | J. Courtney Black, Mohammad Massoodi | 2001-09-25 |
| 6285181 | Method and system for determining the location of an open circuit in a semiconductor device using power modulation | — | 2001-09-04 |
| 6274473 | Flip chip packages | Frank Ruttenberg | 2001-08-14 |
| 6252239 | Substrate removal from a semiconductor chip structure having buried insulator (BIN) | Rama R. Goruganthu | 2001-06-26 |
| 6204516 | Method and apparatus for determining the robustness of memory cells to alpha-particle/cosmic ray induced soft errors | Sunil N. Shabde, Donald L. Wollesen | 2001-03-20 |
| 6181017 | System for marking electrophoretic dies while reducing damage due to electrostatic discharge | Colin Hatchard, Daniel Yim | 2001-01-30 |
| 6119325 | High pressure water stream to separate a multi-layer integrated circuit device and package | J. Courtney Black | 2000-09-19 |
| 6091157 | Method to improve internal package delamination and wire bond reliability using non-homogeneous molding compound pellets | J. Courtney Black, Colin Hatchard | 2000-07-18 |
| 6049465 | Signal carrying means including a carrier substrate and wire bonds for carrying signals between the cache and logic circuitry of a microprocessor | Colin Hatchard, David Lewis | 2000-04-11 |
| 6046507 | Electrophoretic coating methodology to improve internal package delamination and wire bond reliability | Colin Hatchard | 2000-04-04 |
| 6043429 | Method of making flip chip packages | Frank Ruttenberg | 2000-03-28 |
| 6037547 | Via configuration with decreased pitch and/or increased routing space | — | 2000-03-14 |
| 6021074 | Direct access to random redundant logic gates by using multiple short addresses | — | 2000-02-01 |
| 6015280 | Apparatus for reducing warping of plastic packages | — | 2000-01-18 |
| 5914873 | Distributed voltage converter apparatus and method for high power microprocessor with array connections | — | 1999-06-22 |
| 5907561 | Method to improve testing speed of memory | David Lewis | 1999-05-25 |
| 5882738 | Apparatus and method to improve electromigration performance by use of amorphous barrier layer | Bryan Tracy | 1999-03-16 |
| 5489801 | Quad flat package heat slug composition | — | 1996-02-06 |
| 5397746 | Quad flat package heat slug composition | — | 1995-03-14 |
| 4870224 | Integrated circuit package for surface mount technology | William D. Smith, Richard K. Dennis, Nicholas Brathwaite | 1989-09-26 |
| 4213818 | Selective plasma vapor etching process | Kyle E. Lemons, Jan Reimer | 1980-07-22 |