Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5795829 | Method of high density plasma metal etching | — | 1998-08-18 |
| 5770518 | Semiconductor device and method of manufacturing without undercutting conductive lines | — | 1998-06-23 |
| 5702564 | Method of etching conductive lines without undercutting | — | 1997-12-30 |
| 5688717 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Sheshadri Ramaswami, Mark S. Chang, Robin Cheung | 1997-11-18 |
| 5675186 | Construction that prevents the undercut of interconnect lines in plasma metal etch systems | Sheshadri Ramaswami, Mark S. Chang, Robin Cheung | 1997-10-07 |
| 5665641 | Method to prevent formation of defects during multilayer interconnect processing | Robin Cheung | 1997-09-09 |
| 5604381 | Semiconductor device and method of manufacturing without undercutting conductive lines | — | 1997-02-18 |
| 5013675 | Method of forming and removing polysilicon lightly doped drain spacers | Zahra Hadjizadeh-Amini, Hsingya Arthur Wang, James Hsu | 1991-05-07 |
| 4962060 | Making a high speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism | Jack Sliwa, Mohammad Farnaam, Pankaj Dixit | 1990-10-09 |
| 4847674 | High speed interconnect system with refractory non-dogbone contacts and an active electromigration suppression mechanism | Jack Sliwa, Mohammad Farnaam, Pankaj Dixit | 1989-07-11 |