Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498093 | Formation without vacuum break of sacrificial layer that dissolves in acidic activation solution within interconnect | Sergey Lopatin | 2002-12-24 |
| 6498397 | Seed layer with annealed region for integrated circuit interconnects | Amit P. Marathe | 2002-12-24 |
| 6472310 | Tin palladium activation with maximized nuclei density and uniformity on barrier material in interconnect structure | Sergey Lopatin | 2002-10-29 |
| 6462409 | Semiconductor wafer polishing apparatus | Christy Mei-Chu Woo | 2002-10-08 |
| 6426297 | Differential pressure chemical-mechanical polishing in integrated circuit interconnects | Kashmir Sahota, Sergey Lopatin | 2002-07-30 |
| 6423433 | Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby | Sergey Lopatin | 2002-07-23 |
| 6413869 | Dielectric protected chemical-mechanical polishing in integrated circuit interconnects | Steven C. Avanzino, Kashmir Sahota | 2002-07-02 |
| 6291348 | Method of forming Cu-Ca-O thin films on Cu surfaces in a chemical solution and semiconductor device thereby formed | Sergey Lopatin | 2001-09-18 |