Issued Patents All Time
Showing 26–33 of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6177349 | Preventing Cu dendrite formation and growth | Diana M. Schonauer, Steven C. Avanzino | 2001-01-23 |
| 6169034 | Chemically removable Cu CMP slurry abrasive | Steven C. Avanzino, Darrell M. Erb, Diana M. Schonauer | 2001-01-02 |
| 6162727 | Chemical treatment for preventing copper dendrite formation and growth | Diana M. Schonauer, Steven C. Avanzino | 2000-12-19 |
| 6143656 | Slurry for chemical mechanical polishing of copper | Steven C. Avanzino, Christy Mei-Chu Woo | 2000-11-07 |
| 6140239 | Chemically removable Cu CMP slurry abrasive | Steven C. Avanzino, Darrell M. Erb, Diana M. Schonauer | 2000-10-31 |
| 6113462 | Feedback loop for selective conditioning of chemical mechanical polishing pad | — | 2000-09-05 |
| 6103085 | Electroplating uniformity by diffuser design | Christy Mei-Chu Woo, John A. Iacoponi | 2000-08-15 |
| 6074949 | Method of preventing copper dendrite formation and growth | Diana M. Schonauer, Steven C. Avanzino | 2000-06-13 |