Issued Patents All Time
Showing 51–75 of 100 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8216936 | Low capacitance electrical connection via | — | 2012-07-10 |
| 8179159 | Configuration interface to stacked FPGA | Stephen M. Trimberger | 2012-05-15 |
| 8159263 | Programmable integrated circuit with voltage domains | Tim Tuan, Ronald L. Cline | 2012-04-17 |
| 8156456 | Unified design methodology for multi-die integrated circuits | Min-Hsing Chen | 2012-04-10 |
| 8089299 | Integrated circuit with through-die via interface for die stacking and cross-track routing | Bernard J. New | 2012-01-03 |
| 8082537 | Method and apparatus for implementing spatially programmable through die vias in an integrated circuit | — | 2011-12-20 |
| 8063654 | Apparatus and method for testing of stacked die structure | Hong-Tsz Pan, Bang-Thu Nguyen | 2011-11-22 |
| 8058707 | Semiconductor devices having redundant through-die vias and methods of fabricating the same | Stephen M. Trimberger | 2011-11-15 |
| 7998853 | Semiconductor device with through substrate vias | — | 2011-08-16 |
| 7989959 | Method of forming stacked-die integrated circuit | — | 2011-08-02 |
| 7973555 | Configuration interface to stacked FPGA | Stephen M. Trimberger | 2011-07-05 |
| 7968375 | Method and apparatus for integrating capacitors in stacked integrated circuits | Stephen M. Trimberger | 2011-06-28 |
| 7930661 | Software model for a hybrid stacked field programmable gate array | Stephen M. Trimberger, Bernard J. New | 2011-04-19 |
| 7884398 | Floating gate field effect transistors for chemical and/or biological sensing | Kalle Levon, Tsunehiro Sai, Ben Zhao | 2011-02-08 |
| 7863092 | Low cost bumping and bonding method for stacked die | Raghunandan Chaware | 2011-01-04 |
| 7781879 | Apparatus for integrating capacitors in stacked integrated circuits | Stephen M. Trimberger | 2010-08-24 |
| 7765511 | Compensation for performance variation in integrated circuits | Christopher Perez, Christopher H. Kingsley | 2010-07-27 |
| 7727896 | Stacked die manufacturing process | — | 2010-06-01 |
| 7723207 | Three dimensional integrated circuit and method of design | Syed M. Alam, Ibrahim M. Elfadel, Kathryn Guarini, Meikei Ieong, Prabhakar Kudva +2 more | 2010-05-25 |
| 7701251 | Methods and apparatus for implementing a stacked memory programmable integrated circuit system in package | Chidamber R. Kulkarni | 2010-04-20 |
| 7701057 | Semiconductor device having structures for reducing substrate noise coupled from through die vias | Stephen M. Trimberger | 2010-04-20 |
| 7619441 | Apparatus for interconnecting stacked dice on a programmable integrated circuit | Bernard J. New | 2009-11-17 |
| 7605458 | Method and apparatus for integrating capacitors in stacked integrated circuits | Stephen M. Trimberger | 2009-10-20 |
| 7545177 | Method and apparatus for leakage current reduction | Sean W. Kao, Tim Tuan | 2009-06-09 |
| 7518398 | Integrated circuit with through-die via interface for die stacking | Stephen M. Trimberger, Bernard J. New | 2009-04-14 |