Issued Patents All Time
Showing 25 most recent of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12250770 | Board edge electrical contact structures | David North, Daniel Anav, David Harvey, Scott David Dsouza, Alex Chan | 2025-03-11 |
| 10743408 | Array type discrete decoupling under BGA grid | James Michael Schriel, Alex L. Chan | 2020-08-11 |
| 10667399 | Discrete component carrier | Alex Chan | 2020-05-26 |
| 10650181 | Spatial location of vias in a printed circuit board | Alex L. Chan | 2020-05-12 |
| 10257952 | Side clamping BGA socket | Alex L. Chan | 2019-04-09 |
| 9951898 | Anti-tangling coupling device | Benjamin V. Booher | 2018-04-24 |
| 9832899 | Side clamping BGA socket | Alex L. Chan | 2017-11-28 |
| 9769925 | Relieved component pad for 0201 use between vias | Alex L. Chan | 2017-09-19 |
| 9635760 | 0204 shifted vias with merge pads | Alex L. Chan | 2017-04-25 |
| 9560742 | Backdrill reliability anchors | Alex L. Chan | 2017-01-31 |
| 8912449 | Thermal warp compensation IC package | Alex L. Chan | 2014-12-16 |
| 8863071 | De-pop on-device decoupling for BGA | Alex L. Chan | 2014-10-14 |
| 8806420 | In-grid on-device decoupling for BGA | Alex L. Chan | 2014-08-12 |
| 8759689 | Land pattern for 0201 components on a 0.8 mm pitch array | Alex L. Chan | 2014-06-24 |
| 8559180 | Removable IC package stiffening brace and method | Alex L. Chan | 2013-10-15 |
| 8389864 | Warp reactive IC package | Alex L. Chan | 2013-03-05 |
| 7845618 | Valve door with ball coupling | Sam Kim, Jae-Chull Lee, William N. Sterling | 2010-12-07 |
| 7738259 | Shared via decoupling for area arrays components | Alex L. Chan, Charles M. Elliott | 2010-06-15 |
| 7714234 | Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid | — | 2010-05-11 |
| 7697558 | Emergency alert system enhancement using alert server and metro ATM network for DSL deployment | Mark Christopher Pilon, Gerardo M. Espinosa, James Gregory McKaig | 2010-04-13 |
| 7663888 | Printed circuit board thickness adaptors | Simon Creasy, Fabien Letourneau | 2010-02-16 |
| 7602615 | In-grid decoupling for ball grid array (BGA) devices | Alex L. Chan | 2009-10-13 |
| 7368667 | Using rows/columns of micro-vias to create PCB routing channels in BGA interconnect grid (micro-via channels) | — | 2008-05-06 |
| 7365435 | Alternating micro-vias and throughboard vias to create PCB routing channels in BGA interconnect grid | — | 2008-04-29 |
| 7343577 | Area array routing masks for improved escape of devices on PCB | — | 2008-03-11 |