Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10743408 | Array type discrete decoupling under BGA grid | James Michael Schriel, Paul J. Brown | 2020-08-11 |
| 10650181 | Spatial location of vias in a printed circuit board | Paul J. Brown | 2020-05-12 |
| 10257952 | Side clamping BGA socket | Paul J. Brown | 2019-04-09 |
| 9830506 | Method of apparatus for cross-modal face matching using polarimetric image data | Nathaniel Jackson Short, Shuowen Hu, Kristan P. Gurton | 2017-11-28 |
| 9832899 | Side clamping BGA socket | Paul J. Brown | 2017-11-28 |
| 9769925 | Relieved component pad for 0201 use between vias | Paul J. Brown | 2017-09-19 |
| 9635760 | 0204 shifted vias with merge pads | Paul J. Brown | 2017-04-25 |
| 9560742 | Backdrill reliability anchors | Paul J. Brown | 2017-01-31 |
| 8912449 | Thermal warp compensation IC package | Paul J. Brown | 2014-12-16 |
| 8863071 | De-pop on-device decoupling for BGA | Paul J. Brown | 2014-10-14 |
| 8806420 | In-grid on-device decoupling for BGA | Paul J. Brown | 2014-08-12 |
| 8759689 | Land pattern for 0201 components on a 0.8 mm pitch array | Paul J. Brown | 2014-06-24 |
| 8559180 | Removable IC package stiffening brace and method | Paul J. Brown | 2013-10-15 |
| 8389864 | Warp reactive IC package | Paul J. Brown | 2013-03-05 |
| 7738259 | Shared via decoupling for area arrays components | Paul J. Brown, Charles M. Elliott | 2010-06-15 |
| 7602615 | In-grid decoupling for ball grid array (BGA) devices | Paul J. Brown | 2009-10-13 |
| 7460689 | System and method of detecting, recognizing, and tracking moving targets | — | 2008-12-02 |
| 7323787 | Off-grid decoupling of ball grid array (BGA) devices and method | — | 2008-01-29 |