| 10743408 |
Array type discrete decoupling under BGA grid |
James Michael Schriel, Paul J. Brown |
2020-08-11 |
| 10650181 |
Spatial location of vias in a printed circuit board |
Paul J. Brown |
2020-05-12 |
| 10257952 |
Side clamping BGA socket |
Paul J. Brown |
2019-04-09 |
| 9830506 |
Method of apparatus for cross-modal face matching using polarimetric image data |
Nathaniel Jackson Short, Shuowen Hu, Kristan P. Gurton |
2017-11-28 |
| 9832899 |
Side clamping BGA socket |
Paul J. Brown |
2017-11-28 |
| 9769925 |
Relieved component pad for 0201 use between vias |
Paul J. Brown |
2017-09-19 |
| 9635760 |
0204 shifted vias with merge pads |
Paul J. Brown |
2017-04-25 |
| 9560742 |
Backdrill reliability anchors |
Paul J. Brown |
2017-01-31 |
| 8912449 |
Thermal warp compensation IC package |
Paul J. Brown |
2014-12-16 |
| 8863071 |
De-pop on-device decoupling for BGA |
Paul J. Brown |
2014-10-14 |
| 8806420 |
In-grid on-device decoupling for BGA |
Paul J. Brown |
2014-08-12 |
| 8759689 |
Land pattern for 0201 components on a 0.8 mm pitch array |
Paul J. Brown |
2014-06-24 |
| 8559180 |
Removable IC package stiffening brace and method |
Paul J. Brown |
2013-10-15 |
| 8389864 |
Warp reactive IC package |
Paul J. Brown |
2013-03-05 |
| 7738259 |
Shared via decoupling for area arrays components |
Paul J. Brown, Charles M. Elliott |
2010-06-15 |
| 7602615 |
In-grid decoupling for ball grid array (BGA) devices |
Paul J. Brown |
2009-10-13 |
| 7460689 |
System and method of detecting, recognizing, and tracking moving targets |
— |
2008-12-02 |
| 7323787 |
Off-grid decoupling of ball grid array (BGA) devices and method |
— |
2008-01-29 |
