Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8076765 | Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors | Kuang-Hsiung Chen, Chi-Chih Shen, Jen-Chuan Chen, Wen-Hsiung Chang, Hui-Shan Chang +5 more | 2011-12-13 | $912,000 |