Issued Patents All Time
Showing 26–50 of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11298727 | Substrate cleaning apparatus | Hui Wang, Jun Wu, Cheng-Liang Cheng, Zhenming Chu | 2022-04-12 |
| 11257667 | Methods and apparatus for cleaning semiconductor wafers | Jun Wang, Hui Wang, Fufa Chen, Fuping Chen, Jian Wang +5 more | 2022-02-22 |
| 11254126 | Device and method for coating surfaces | Michael Carl Junger, Sasikaran KANDASAMY, Neil Harris, Christopher Flaim | 2022-02-22 |
| 11141762 | System for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xiaoyan Zhang +5 more | 2021-10-12 |
| 11103898 | Methods and apparatus for cleaning substrates | Hui Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang +4 more | 2021-08-31 |
| 11092546 | Spectrometer utilizing surface plasmon | Wonjae Joo, Jie Yao | 2021-08-17 |
| 11037804 | Methods and apparatus for cleaning substrates | Hui Wang, Fuping Chen, Fufa Chen, Jian Wang, Xiaoyan Zhang +4 more | 2021-06-15 |
| 11000782 | Method and apparatus for cleaning substrates using high temperature chemicals and ultrasonic device | Fuping Chen, Hui Wang, Shena Jia, Danying Wang, Chaowei Jiang +2 more | 2021-05-11 |
| 10999105 | Channel estimation method and device | Yuetan Chen, Quanfei Hu | 2021-05-04 |
| 10917864 | Method and device for realizing synchronization | Xiaojuan Zhang, Gang Wu | 2021-02-09 |
| 10910244 | Methods and system for cleaning semiconductor wafers | Hui Wang, Fufa Chen, Fuping Chen, Jian Wang, Xiaoyan Zhang +5 more | 2021-02-02 |
| 10907266 | Method and apparatus for uniformly metallization on substrate | Hui Wang, Fuping Chen | 2021-02-02 |
| 10770315 | Fall-proof apparatus for cleaning semiconductor devices and a chamber with the apparatus | Zhenming Chu, Hui Wang, Shena Jia, Jun Wu, Fuping Chen +1 more | 2020-09-08 |
| 10529590 | Annealing method for improving bonding strength | Xing Wei, Yongwei Chang, Meng Chen, Guoxing CHEN, Lu Fei | 2020-01-07 |
| 10416089 | System and method for validating cleanliness of a surface | Andrew S. Walsh, Nick Downey | 2019-09-17 |
| 10388529 | Method for preparing substrate with insulated buried layer | Xing Wei, Yongwei Chang, Meng Chen, Guoxing CHEN, Lu Fei | 2019-08-20 |
| 10361114 | Method for preparing substrate with carrier trapping center | Xing Wei, Yongwei Chang, Meng Chen, Guoxing CHEN, Lu Fei | 2019-07-23 |
| 10297472 | Method and apparatus for cleaning semiconductor wafer | Hui Wang, Fuping Chen, Liangzhi Xie, Shena Jia, Xiaoyan Zhang | 2019-05-21 |
| 10243634 | Method and device for dual layer beamforming | Xiaojuan Zhang | 2019-03-26 |
| 10180949 | Method and apparatus for information searching | Zhen Wang, Na Zhang, Kai Chen, Wenbo Yang | 2019-01-15 |
| 10141205 | Apparatus and method for cleaning semiconductor wafer | Cheng-Liang Cheng, Jun Wu, Hui Wang | 2018-11-27 |
| 10113244 | Method and apparatus for uniformly metallization on substrate | Hui Wang, Fuping Chen | 2018-10-30 |
| 9953118 | Modeling method of SPICE model series of SOI FET | Jing Chen, Qingqing Wu, Jiexin Luo, Zhan Chai | 2018-04-24 |
| 9786808 | Method of anodising a surface of a semiconductor device | Jie Cui | 2017-10-10 |
| 9666426 | Methods and apparatus for uniformly metallization on substrates | Hui Wang, Yue Ma, Chuan He | 2017-05-30 |