Issued Patents All Time
Showing 25 most recent of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11587911 | Process for producing a high-frequency-compatible electronic module | — | 2023-02-21 |
| 10483180 | Process for the wafer-scale fabrication of hermetic electronic modules | Alexandre Val | 2019-11-19 |
| 10332863 | Method of miniaturized chip on chip interconnection of a 3D electronic module | — | 2019-06-25 |
| 10064278 | 3D electronic module comprising a ball grid array stack | — | 2018-08-28 |
| 9899250 | Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz | — | 2018-02-20 |
| 9111688 | Method for producing reconstituted wafers with support of the chips during their encapsulation | — | 2015-08-18 |
| 8735220 | Method for positioning chips during the production of a reconstituted wafer | — | 2014-05-27 |
| 8716036 | Method for collective fabrication of 3D electronic modules comprising only validated PCBs | — | 2014-05-06 |
| 8567051 | Process for the vertical interconnection of 3D electronic modules by vias | — | 2013-10-29 |
| 8546190 | Method for positioning chips during the production of a reconstituted wafer | — | 2013-10-01 |
| 8359740 | Process for the wafer-scale fabrication of electronic modules for surface mounting | Pascal Couderc, Alexandre Val | 2013-01-29 |
| 8264853 | 3D electronic module | Olivier Lignier | 2012-09-11 |
| 8243468 | Low-thickness electronic module comprising a stack of electronic packages provided with connection balls | — | 2012-08-14 |
| 8136237 | Method of interconnecting electronic wafers | — | 2012-03-20 |
| 7951649 | Process for the collective fabrication of 3D electronic modules | — | 2011-05-31 |
| 7877874 | Process for the collective fabrication of 3D electronic modules | — | 2011-02-01 |
| 7635639 | Method for the interconnection of active and passive components and resulting thin heterogeneous component | Olivier Lignier | 2009-12-22 |
| 7476965 | Electronic device with integrated heat distributor | Olivier Lignier, Regis Bocage | 2009-01-13 |
| 6809367 | Device for interconnecting, in three dimensions, electronic components | — | 2004-10-26 |
| 6716672 | Three dimensional interconnection method and electronic device obtained by same | — | 2004-04-06 |
| 6307261 | Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device | Yves Campenhout, Dominique Gilet | 2001-10-23 |
| 5885850 | Method for the 3D interconnection of packages of electronic components, and device obtained by this method | — | 1999-03-23 |
| 5847448 | Method and device for interconnecting integrated circuits in three dimensions | Michel Leroy | 1998-12-08 |
| 5640760 | Method for the 3D interconnection of packages of electronic components using printed circuit boards | Andre Gerard | 1997-06-24 |
| 5637536 | Method for interconnecting semiconductor chips in three dimensions, and component resulting therefrom | — | 1997-06-10 |