Christian Val — 42 Patents at 3D Plus

Christian Val has been granted 42 US patents while listed as an inventor at 3D Plus. The first was granted in 1980 and the most recent in February 2023. Christian Val ranks #72,062 of 4,157,543 US inventors in our database (top 1.7%). Patent records list Christian Val in Voisins-le-Bretonneux, FR.

Issued Patents All Time

Showing 1–25 of 42 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11587911	Process for producing a high-frequency-compatible electronic module	—	2023-02-21
10483180	Process for the wafer-scale fabrication of hermetic electronic modules	Alexandre Val	2019-11-19
10332863	Method of miniaturized chip on chip interconnection of a 3D electronic module	—	2019-06-25
10064278	3D electronic module comprising a ball grid array stack	—	2018-08-28
9899250	Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz	—	2018-02-20
9111688	Method for producing reconstituted wafers with support of the chips during their encapsulation	—	2015-08-18
8735220	Method for positioning chips during the production of a reconstituted wafer	—	2014-05-27
8716036	Method for collective fabrication of 3D electronic modules comprising only validated PCBs	—	2014-05-06
8567051	Process for the vertical interconnection of 3D electronic modules by vias	—	2013-10-29
8546190	Method for positioning chips during the production of a reconstituted wafer	—	2013-10-01
8359740	Process for the wafer-scale fabrication of electronic modules for surface mounting	Pascal Couderc, Alexandre Val	2013-01-29
8264853	3D electronic module	Olivier Lignier	2012-09-11
8243468	Low-thickness electronic module comprising a stack of electronic packages provided with connection balls	—	2012-08-14
8136237	Method of interconnecting electronic wafers	—	2012-03-20
7951649	Process for the collective fabrication of 3D electronic modules	—	2011-05-31
7877874	Process for the collective fabrication of 3D electronic modules	—	2011-02-01
7635639	Method for the interconnection of active and passive components and resulting thin heterogeneous component	Olivier Lignier	2009-12-22
7476965	Electronic device with integrated heat distributor	Olivier Lignier, Regis Bocage	2009-01-13
6809367	Device for interconnecting, in three dimensions, electronic components	—	2004-10-26
6716672	Three dimensional interconnection method and electronic device obtained by same	—	2004-04-06
6307261	Method for the manufacturing of a semiconductor device which comprises at least one chip and corresponding device	Yves Campenhout, Dominique Gilet	2001-10-23	$255,000
5885850	Method for the 3D interconnection of packages of electronic components, and device obtained by this method	—	1999-03-23
5847448	Method and device for interconnecting integrated circuits in three dimensions	Michel Leroy	1998-12-08
5640760	Method for the 3D interconnection of packages of electronic components using printed circuit boards	Andre Gerard	1997-06-24
5637536	Method for interconnecting semiconductor chips in three dimensions, and component resulting therefrom	—	1997-06-10

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Christian Val — 42 Patents

Issued Patents All Time

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