Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5526230 | 3D interconnection process for electronic component packages and resulting 3D components | — | 1996-06-11 |
| 5461545 | Process and device for hermetic encapsulation of electronic components | Michel Leroy | 1995-10-24 |
| 5400218 | Device for the 3D encapsulation of semiconductor chips | — | 1995-03-21 |
| 5323533 | Method of producing coaxial connections for an electronic component, and component package | — | 1994-06-28 |
| 5237204 | Electric potential distribution device and an electronic component case incorporating such a device | — | 1993-08-17 |
| 5002895 | Wire bonding method with a frame, for connecting an electronic component for testing and mounting | Guy Le Parquier | 1991-03-26 |
| 4755910 | Housing for encapsulating an electronic circuit | — | 1988-07-05 |
| 4654694 | Electronic component box supplied with a capacitor | — | 1987-03-31 |
| 4639826 | Radiation-hardened casing for an electronic component | Joseph Pinel, Yves B. Gibod | 1987-01-27 |
| 4559579 | Device for the protection of an electronic component and/or circuit against the disturbances (voltages) generated by an external electromagnetic field | — | 1985-12-17 |
| 4553020 | Electronic component package comprising a moisture-retention element | — | 1985-11-12 |
| 4546028 | Composite substrate with high heat conduction | — | 1985-10-08 |
| 4518818 | Encapsulating case able to resist high external pressures | Jacques Le Ny | 1985-05-21 |
| 4517356 | Process for polymerizing thermosetting resins | Francois Lambert | 1985-05-14 |
| 4413170 | Thermal printing head | Didier Pribat | 1983-11-01 |
| 4408256 | Microbox for electronic circuit and hybrid circuit having such a microbox | — | 1983-10-04 |
| 4216444 | Step adjustable attenuator | Claude Vergnolle | 1980-08-05 |