Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz

Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz

US Patent 9899250 · Granted Feb 20, 2018

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process for producing a high-frequency-compatible electronic module2023
Process for the wafer-scale fabrication of hermetic electronic modules2019
Method of miniaturized chip on chip interconnection of a 3D electronic module2019
3D electronic module comprising a ball grid array stack2018
Method for producing reconstituted wafers with support of the chips during their2015
Method for positioning chips during the production of a reconstituted wafer2014
Method for collective fabrication of 3D electronic modules comprising only valid2014
Process for the vertical interconnection of 3D electronic modules by vias2013
Method for positioning chips during the production of a reconstituted wafer2013
Process for the wafer-scale fabrication of electronic modules for surface mounti2013
3D electronic module2012
Low-thickness electronic module comprising a stack of electronic packages provid2012