Issued Patents 2025
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191282 | Shared pad/bridge layout for a 3D IC | Harry-Hak-Lay Chuang, Wen-Tuo Huang, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang +5 more | 2025-01-07 |
| 12191239 | Stacked via structure disposed on a conductive pillar of a semiconductor die | Che-Yu Yeh, Tsung-Shu Lin, Tsung-Yu Chen, Li-Han Hsu, Chien-Fu Tseng | 2025-01-07 |