Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400983 | Semiconductor packages and methods of manufacturing thereof | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Yu-Ling Hsu, Pai Chi Chou, Ya-Chi Hung | 2025-08-26 |
| 12389668 | Polysilicon resistor structures | Meng-Han Lin, Yong-Shiuan Tsair | 2025-08-12 |
| 12374658 | Bonded wafer device structure and methods for making the same | Harry-Hak-Lay Chuang, Wei-Cheng Wu | 2025-07-29 |
| 12277977 | ONON sidewall structure for memory device and method for making the same | Chen-Ming Huang, Yu-Hsiang Yang, Yu-Ling Hsu, Wei-Lin Chang, Chia-Sheng Lin +5 more | 2025-04-15 |
| 12278166 | High bandwidth package structure | Harry Chuang, Wei-Cheng Wu, Yu-Ling Hsu, Pai Chi Chou, Ya-Chi Hung | 2025-04-15 |
| 12191282 | Shared pad/bridge layout for a 3D IC | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Chia-Sheng Lin, Wei Chuang Wu, Shih Kuang Yang +5 more | 2025-01-07 |