Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381158 | Wafer bonding method and bonded device structure | Yuan-Jen Lee, Nuo Xu, Fang-Lan Chu, Wei-Cheng Wu | 2025-08-05 |
| 12278166 | High bandwidth package structure | Wen-Tuo Huang, Wei-Cheng Wu, Yu-Ling Hsu, Pai Chi Chou, Ya-Chi Hung | 2025-04-15 |