Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
FC

Fang-Lan Chu

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #391,696 of 469,880Top 85%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12381158 Wafer bonding method and bonded device structure Harry Chuang, Yuan-Jen Lee, Nuo Xu, Wei-Cheng Wu 2025-08-05