Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400983 | Semiconductor packages and methods of manufacturing thereof | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Yu-Ling Hsu, Pai Chi Chou | 2025-08-26 |
| 12278166 | High bandwidth package structure | Harry Chuang, Wen-Tuo Huang, Wei-Cheng Wu, Yu-Ling Hsu, Pai Chi Chou | 2025-04-15 |
| 12272756 | Semiconductor device | Yu-Chun Shen, Chi-Chung Jen, Yu-Chu Lin, Wen-Chih Chiang | 2025-04-08 |
| 12261228 | Semiconductor device | Chi-Chung Jen, Yu-Chun Shen, Shun-Neng Wang, Wen-Chih Chiang | 2025-03-25 |