Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400983 | Semiconductor packages and methods of manufacturing thereof | Harry-Hak-Lay Chuang, Wei-Cheng Wu, Wen-Tuo Huang, Yu-Ling Hsu, Ya-Chi Hung | 2025-08-26 |
| 12302584 | Embedded ferroelectric memory in high-k first technology | Wei-Cheng Wu | 2025-05-13 |
| 12278166 | High bandwidth package structure | Harry Chuang, Wen-Tuo Huang, Wei-Cheng Wu, Yu-Ling Hsu, Ya-Chi Hung | 2025-04-15 |