Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
WL

Wei-Cheng Lin

TSMC: 26 patents #52 of 3,957Top 2%
NU National Tsing Hua University: 1 patents #18 of 124Top 15%
QU Quantumz: 1 patents #7 of 9Top 80%
📍 Taichung, CA: #3 of 65 inventorsTop 5%
Overall (2025): #718 of 469,880Top 1%
29
Patents 2025

Issued Patents 2025

Showing 26–29 of 29 patents

Patent #TitleCo-InventorsDate
12225973 Method for manufacturing recycled carbon fiber underlay and recycled carbon fiber arch insole with recycled carbon fiber underlay 2025-02-18
12230572 Backside signal interconnection Yu-Xuan Huang, Ching-Wei Tsai, Yi-Hsun Chiu, Yi-Bo Liao, Kuan-Lun Cheng +6 more 2025-02-18
12218050 Manufacturing method for semiconductor device Te-Hsin Chiu, Wei-An Lai, Meng-Hung Shen, Jiann-Tyng Tzeng, Kam-Tou Sio 2025-02-04
12218141 Hybrid fin field-effect transistor cell structures and related methods Wei-An Lai, Hui-Zhong Zhuang, Jiann-Tyng Tzeng, Lipen Yuan, Yan-Hao Chen 2025-02-04