Issued Patents 2025
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12426323 | Semiconductor device including vertical transistor with back side power structure | Shih-Wei Peng, Jiann-Tyng Tzeng | 2025-09-23 |
| 12396255 | Multiple back side/buried power rail (BPR) cell including field-effect transistors with air void between two adjacent BPR cells | Kam-Tou Sio, Jiann-Tyng Tzeng | 2025-08-19 |
| 12388016 | Deep lines and shallow lines in signal conducting paths | Wei-An Lai, Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng, Chia-Tien Wu | 2025-08-12 |
| 12321679 | Integrated circuit, system and method of forming the same | Shih-Wei Peng, Jiann-Tyng Tzeng | 2025-06-03 |
| 12278238 | Semiconductor structure and method of forming the same | Shih-Wei Peng, Wei-Cheng Lin, Jiann-Tyng Tzeng | 2025-04-15 |
| 12278185 | Power distribution method | Shih-Wei Peng, Jiann-Tyng Tzeng | 2025-04-15 |
| 12266657 | Hybrid cell-based device, layout, and method | Yu-Xuan Huang, Shih-Wei Peng, Hou-Yu Chen, Kuan-Lun Cheng, Jiann-Tyng Tzeng | 2025-04-01 |
| 12255148 | Power distribution structure and method | Shih-Wei Peng, Jiann-Tyng Tzeng | 2025-03-18 |
| 12218050 | Manufacturing method for semiconductor device | Wei-An Lai, Meng-Hung Shen, Wei-Cheng Lin, Jiann-Tyng Tzeng, Kam-Tou Sio | 2025-02-04 |
| 12218057 | Integrated circuit with backside interconnections and method of making same | Shih-Wei Peng, Wei-An Lai, Ching-Wei Tsai, Jiann-Tyng Tzeng | 2025-02-04 |