Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412863 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Kuei-Sung Chang | 2025-09-09 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Kuei-Sung Chang, Chun-Wen Cheng | 2025-07-15 |
| 12322722 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Kuei-Sung Chang | 2025-06-03 |
| 12303888 | Method to produce chemical pattern in micro-fluidic structure | Li-Min Hung, Jung-Huei Peng, Shane Bowen, Hui Han, Danny Yuan Chan +1 more | 2025-05-20 |
| 12191185 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shou-Wen Kuo, Kuei-Sung Chang, Jiun-Rong Pai +2 more | 2025-01-07 |