Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
TH

Tsung-Lin Hsieh

TSMC: 1 patents #2,025 of 3,957Top 55%
Overall (2025): #185,664 of 469,880Top 40%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12358783 Wire-bond damper for shock absorption Wei-Jhih Mao, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng 2025-07-15