Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412863 | Die attached leveling control by metal stopper bumps | Kuei-Sung Chang, Shang-Ying Tsai | 2025-09-09 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Shang-Ying Tsai, Kuei-Sung Chang, Chun-Wen Cheng | 2025-07-15 |
| 12322722 | Die attached leveling control by metal stopper bumps | Kuei-Sung Chang, Shang-Ying Tsai | 2025-06-03 |