Issued Patents 2025
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412863 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Shang-Ying Tsai | 2025-09-09 |
| 12358783 | Wire-bond damper for shock absorption | Tsung-Lin Hsieh, Wei-Jhih Mao, Shang-Ying Tsai, Chun-Wen Cheng | 2025-07-15 |
| 12322722 | Die attached leveling control by metal stopper bumps | Wei-Jhih Mao, Shang-Ying Tsai | 2025-06-03 |
| 12297097 | Bypass structure | Eason Hsieh, Fei-Lung Lai | 2025-05-13 |
| 12234141 | Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same | Tai-Bang An, Chun-Wen Cheng, Hung-Hua Lin | 2025-02-25 |
| 12191185 | Vacuum wafer chuck for manufacturing semiconductor devices | Chien-Fa Lee, Chin-Lin CHOU, Shang-Ying Tsai, Shou-Wen Kuo, Jiun-Rong Pai +2 more | 2025-01-07 |