Issued Patents 2025
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406851 | High aspect ratio bosch deep etch | Yu-Hsing Chang, Shih-Chang Liu | 2025-09-02 |
| 12356639 | Double-sided stacked DTC structure | — | 2025-07-08 |
| 12347799 | Bond pad structure coupled to multiple interconnect conductive\ structures through trench in substrate | — | 2025-07-01 |
| 12317568 | Semiconductor structure including source/drain regions at different levels within semiconductor layer and method of manufacture | Yong-Sheng Huang | 2025-05-27 |
| 12255207 | Boundary design for high-voltage integration on HKMG technology | Yi-Huan Chen, Chien-Chih Chou, Alexander Kalnitsky, Kong-Beng Thei, Shih-Chung Hsiao +1 more | 2025-03-18 |
| 12237647 | Techniques for vertical cavity surface emitting laser oxidation | Chen Chen, Jhih-Bin Chen | 2025-02-25 |
| 12219770 | Integrated chip with a gate structure disposed within a trench | Yong-Sheng Huang | 2025-02-04 |
| 12211896 | High voltage device with gate extensions | Jhih-Bin Chen | 2025-01-28 |
| 12213383 | Fully-wet via patterning method in piezoelectric sensor | Ting-Jung Chen | 2025-01-28 |
| 12204232 | Semiconductor device having a gate electrode with a top peripheral portion and a top central portion, and the top peripheral portion is a protrusion or a depression surrounding the top central portion | Hung-Shu Huang, Tung-He Chou | 2025-01-21 |
| 12193227 | Etch method for opening a source line in flash memory | Yong-Sheng Huang, Chih-Pin Huang | 2025-01-07 |