Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12358785 | Comb electrode release process for MEMS structure | Lee-Chuan Tseng | 2025-07-15 |
| 12272585 | Wafer chuck structure with holes in upper surface to improve temperature uniformity | Shih-Wei Lin, Lee-Chuan Tseng | 2025-04-08 |
| 12238478 | Top notch slit profile for MEMS device | — | 2025-02-25 |
| 12213383 | Fully-wet via patterning method in piezoelectric sensor | Ming Chyi Liu | 2025-01-28 |