Partial year: Data through Q3 2025 (Sept 30). Full-year totals not yet available.
IC

I-Nan Chen

TSMC: 1 patents #2,025 of 3,957Top 55%
📍 Jinshanmian, TW: #125 of 379 inventorsTop 35%
Overall (2025): #362,009 of 469,880Top 80%
1
Patents 2025

Issued Patents 2025

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12315843 Hybrid bonding technology for stacking integrated circuits Kuo-Ming Wu, Ching-Chun Wang, Dun-Nian Yaung, Hsing-Chih Lin, Jen-Cheng Liu +3 more 2025-05-27