Issued Patents 2025
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12396205 | Semiconductor device having fins and method of fabricating the same | Shu-Hao Kuo, Jung-Hao Chang, Li-Te Lin, Kuo-Cheng Ching | 2025-08-19 |
| 12396245 | Semiconductor arrangement and method for making | Wei-Lun Chen, Li-Te Lin, Pinyen Lin | 2025-08-19 |
| 12261085 | Semiconductor device with reduced loading effect | Wei-Lun Chen, Li-Te Lin | 2025-03-25 |
| 12224210 | Method for FinFet fabrication and structure thereof | Han-Yu Lin, Yi-Ruei Jhan, Fang-Wei Lee, Tze-Chung Lin, Li-Te Lin +2 more | 2025-02-11 |