Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431445 | Methods related to dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Robert Francis Darveaux | 2025-09-30 |
| 12362267 | Electronic package and method for manufacturing an electronic package | Hoang Mong Nguyen, Howard E. Chen, Ki Wook Lee, Yi Liu | 2025-07-15 |
| 12261127 | Application of conductive via or trench for intra module EMI shielding | Hoang Mong Nguyen, Matthew Sean Read, Howard E. Chen, Ki Wook Lee, Yi Liu | 2025-03-25 |