Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362267 | Electronic package and method for manufacturing an electronic package | Hoang Mong Nguyen, Anthony James LoBianco, Howard E. Chen, Ki Wook Lee | 2025-07-15 |
| 12306123 | Preparation method and analysis method of monolayer two-dimensional materials | Kai-Chun Chuang, Chi-An Li, Sheng-Chih Hsu | 2025-05-20 |
| 12283557 | Integrated circuit structure | Aaron Chen, Chi Ren | 2025-04-22 |
| 12261127 | Application of conductive via or trench for intra module EMI shielding | Anthony James LoBianco, Hoang Mong Nguyen, Matthew Sean Read, Howard E. Chen, Ki Wook Lee | 2025-03-25 |