Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261127 | Application of conductive via or trench for intra module EMI shielding | Anthony James LoBianco, Hoang Mong Nguyen, Howard E. Chen, Ki Wook Lee, Yi Liu | 2025-03-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261127 | Application of conductive via or trench for intra module EMI shielding | Anthony James LoBianco, Hoang Mong Nguyen, Howard E. Chen, Ki Wook Lee, Yi Liu | 2025-03-25 |