Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362267 | Electronic package and method for manufacturing an electronic package | Anthony James LoBianco, Howard E. Chen, Ki Wook Lee, Yi Liu | 2025-07-15 |
| 12261127 | Application of conductive via or trench for intra module EMI shielding | Anthony James LoBianco, Matthew Sean Read, Howard E. Chen, Ki Wook Lee, Yi Liu | 2025-03-25 |