Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431445 | Methods related to dual-sided module with land-grid array (LGA) footprint | Howard E. Chen, Anthony James LoBianco | 2025-09-30 |
| 12191241 | Fine pitch copper pillar package and method | David McCann, John McCormick, Louis W. Nicholls | 2025-01-07 |