Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Hideo Nakako, Yuki KAWANA, Motoki YONEKURA, Shinichirou Sukata, Manabu Ishii +4 more | 2025-07-08 |
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Kunihiko Akai, Masayuki Miyaji, Junichi KAKEHATA | 2025-03-11 |
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Kunihiko Akai, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata, Masayuki Miyaji | 2025-03-11 |
| 12233460 | Copper paste, wick formation method, and heat pipe | Hideo Nakako, Toshiaki Tanaka, Dai Ishikawa, Michiko Natori | 2025-02-25 |