Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Yuki KAWANA, Motoki YONEKURA, Shinichirou Sukata +4 more | 2025-07-08 |
| 12233460 | Copper paste, wick formation method, and heat pipe | Hideo Nakako, Toshiaki Tanaka, Dai Ishikawa, Yoshinori Ejiri | 2025-02-25 |