Issued Patents 2025
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Yuki KAWANA, Shinichirou Sukata, Manabu Ishii +4 more | 2025-07-08 |