Issued Patents 2025
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12354914 | Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation | Yoshinori Ejiri, Hideo Nakako, Yuki KAWANA, Motoki YONEKURA, Manabu Ishii +4 more | 2025-07-08 |
| 12297377 | Conductive adhesive composition, and method for producing connection structure | — | 2025-05-13 |
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Kunihiko Akai, Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Masayuki Miyaji | 2025-03-11 |