Issued Patents 2025
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Kunihiko Akai, Junichi KAKEHATA, Yoshinori Ejiri | 2025-03-11 |
| 12247270 | Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recesses | Kunihiko Akai, Yoshinori Ejiri, Yuuhei Okada, Toshimitsu MORIYA, Shinichirou Sukata | 2025-03-11 |