Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12424453 | Low temperature direct copper-copper bonding | Stephen J. Banik, II, Justin Oberst, Kari Thorkelsson, Bryan L. Buckalew | 2025-09-23 |
| 12392047 | Byproduct removal from electroplating solutions | Joseph Richardson, Jae Shin, Jeyavel Velmurugan, Elizabeth Calora, Steven T. Mayer | 2025-08-19 |
| 12305307 | TSV process window and fill performance enhancement by long pulsing and ramping | Jae Shin, Joseph Richardson, Jeyavel Velmurugan, Steven T. Mayer | 2025-05-20 |
| 12293943 | Gold through silicon mask plating | Lee Peng Chua, Defu Liang, Jacob Kurtis Blickensderfer, Bryan L. Buckalew, Steven T. Mayer | 2025-05-06 |