Issued Patents 2025
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12392047 | Byproduct removal from electroplating solutions | Joseph Richardson, Jae Shin, Jeyavel Velmurugan, Elizabeth Calora, Thomas A. Ponnuswamy | 2025-08-19 |
| 12305307 | TSV process window and fill performance enhancement by long pulsing and ramping | Jae Shin, Joseph Richardson, Jeyavel Velmurugan, Thomas A. Ponnuswamy | 2025-05-20 |
| 12293943 | Gold through silicon mask plating | Lee Peng Chua, Defu Liang, Jacob Kurtis Blickensderfer, Thomas A. Ponnuswamy, Bryan L. Buckalew | 2025-05-06 |
| 12241173 | Wafer shielding for prevention of lipseal plate-out | Gregory J. Kearns, Lee Peng Chua, Jacob Kurtis Blickensderfer | 2025-03-04 |